Communications on Applied Electronics
Foundation of Computer Science (FCS), NY, USA
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Volume 2 - Issue 7 |
Published: August 2015 |
Authors: Neha Somra, Kanika Mishra, Ravinder Singh Sawhney |
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Neha Somra, Kanika Mishra, Ravinder Singh Sawhney . Optimizing Current Characteristics of 32 nm FinFET by Controlling Fin Width. Communications on Applied Electronics. 2, 7 (August 2015), 1-5. DOI=10.5120/cae2015651795
@article{ 10.5120/cae2015651795, author = { Neha Somra,Kanika Mishra,Ravinder Singh Sawhney }, title = { Optimizing Current Characteristics of 32 nm FinFET by Controlling Fin Width }, journal = { Communications on Applied Electronics }, year = { 2015 }, volume = { 2 }, number = { 7 }, pages = { 1-5 }, doi = { 10.5120/cae2015651795 }, publisher = { Foundation of Computer Science (FCS), NY, USA } }
%0 Journal Article %D 2015 %A Neha Somra %A Kanika Mishra %A Ravinder Singh Sawhney %T Optimizing Current Characteristics of 32 nm FinFET by Controlling Fin Width%T %J Communications on Applied Electronics %V 2 %N 7 %P 1-5 %R 10.5120/cae2015651795 %I Foundation of Computer Science (FCS), NY, USA
The FinFET transistor structure assures to rejuvenate the chip industry by rescuing it from the short-channel effects that limits the device scalability endured by current planar transistor structures. In this thesis, we report the design, fabrication and physical characteristics of n-channel FinFET with physical gate length of 32nm using visual TCAD (steady state analysis). All the measurements were performed at a supply voltage of 1.5V and 5 nm oxide thickness. We report the drain saturation current is 0.0343453mA at Vg=1V and 0.0410523mA at Vg=1.5V which indicates approximately 20 percent hike in Id with increase in 0.5V gate voltage. We simulate the device for distinct fin thickness from 5 nm to 50 nm. In this thesis we report, for 32 nm gate length FinFET having above 21.33 nm fin width would consequence in short channel effects in spite of having high drain current.